JPH0122742B2 - - Google Patents
Info
- Publication number
- JPH0122742B2 JPH0122742B2 JP58108837A JP10883783A JPH0122742B2 JP H0122742 B2 JPH0122742 B2 JP H0122742B2 JP 58108837 A JP58108837 A JP 58108837A JP 10883783 A JP10883783 A JP 10883783A JP H0122742 B2 JPH0122742 B2 JP H0122742B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- cooling
- refrigerant
- air
- cooling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10883783A JPS60761A (ja) | 1983-06-17 | 1983-06-17 | 液冷モジユ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10883783A JPS60761A (ja) | 1983-06-17 | 1983-06-17 | 液冷モジユ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60761A JPS60761A (ja) | 1985-01-05 |
| JPH0122742B2 true JPH0122742B2 (en]) | 1989-04-27 |
Family
ID=14494814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10883783A Granted JPS60761A (ja) | 1983-06-17 | 1983-06-17 | 液冷モジユ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60761A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6285448A (ja) * | 1985-10-09 | 1987-04-18 | Fujitsu Ltd | 半導体装置の冷却構造 |
| JP4637734B2 (ja) | 2005-11-30 | 2011-02-23 | 富士通株式会社 | 電子装置の冷却装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57103338A (en) * | 1980-12-19 | 1982-06-26 | Hitachi Ltd | Boiling cooling device |
-
1983
- 1983-06-17 JP JP10883783A patent/JPS60761A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60761A (ja) | 1985-01-05 |
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